Chips JU - Lab to Fab Accelerators for Advanced Packaging and Heterogeneous Integration (Chips for Europe 2025)
€50,000 - €1,300,000
May 07, 2026
Denmark
organization, consortium
About This Opportunity
The Chips for Europe Initiative supports technological capacity building and innovation in the Union. Research and innovation activities aim to reinforce the EU's strategic autonomy in electronic components and systems, supporting future needs of industries and the economy. The Lab-to-Fab Transfer Accelerator prepares and speeds the transfer of advanced packaging technologies from pilot lines to industrial deployment, expanding Europe's packaging ecosystem, boosting competitiveness, and reinforcing resilient supply chains. Innovation Fund Denmark offers co-funding to Danish participants in projects successful in this call. The call targets Danish companies, research organisations, and RTOs. All Danish organisations directly involved in activities in the projects are eligible as applicants to Innovation Fund Denmark.
Who Can Apply
- Region
- Denmark
- Residency
- Denmark
- Project in
- Denmark
- Applicants
- organization, consortium
- Organizations
- for profit, academic
Application Details
Stages
- 1 single_stage
Required documents
Review process
Applications are submitted to international secretariat or IFD. Danish participants upload additional documents via e-grant platform approximately 2-4 weeks after deadline, including consortium agreement, budget sheet, and Gantt diagram.
Restrictions
- reporting_requirements
- no_concurrent_funding
Post-award obligations
- final_report
- acknowledge_funder
External Application
This opportunity requires you to apply directly on the funder's website.
Apply on External SiteAI-Extracted Data
This opportunity was automatically extracted from an external source using AI. Details such as amounts, deadlines, and eligibility may be incomplete or inaccurate.
Always verify on the official sourceKey Information
- Award Amount
- €50,000 - €1,300,000
- Application Deadline
-
May 07, 2026 at 23:59 UTCDue in 66 days
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