Hybrid manufacturing of novel RF electronic circuits

The Army Research Laboratory Research Associateship Program (ARL-RAP) opportunity focuses on modeling and simulating useful 3D RF structures intended for manufacturing on direct-write tools which have integrated pick-n-place and milling capabilities. The project requires RF structures to be tested, verified, and optimized with simulations such as HFSS. Knowledge on manufacturing volumetric circuits is a requirement to complete this project. The research will be conducted within the Sensors and Electron Devices Directorate (SEDD), the Army's principal center for research and development in the exploration and exploitation of the electromagnetic spectrum, including radio frequency, microwave, millimeter-wave, infrared, visible, and audio regions. The ARL-RAP is designed to significantly increase the involvement of creative and highly trained scientists and engineers from academia and industry in scientific and technical areas of interest and relevance to the Army. Selected participants will work with ARL scientists and engineers on cutting-edge research in 3D printed circuits, hybrid circuits, 3D slicing, RF testing, and RF simulation.