Topological Materials & Interfacial Coupling for Topologically Enabled Devices (TED)
Not specified
No deadline
United States
individual
About This Opportunity
The U.S. Army Research Laboratory (ARL) seeks a highly motivated, well informed, cross-disciplinary and skilled research fellow with experience in theoretical/computational modeling and characterization of topological, magnetic materials and heterostructures. This research fellow will study structural, electronics and magnetic properties of topological insulator (TI)/magnetic material heterostructures with quantum mechanical first principle method. The research fellowship is a critical part of on-going DOD-wide research project on topologically enabled devices (TED). ARL is accelerating a strategic initiative to move the physics of topological materials to the engineering of emerging electronic devices that may solve future battlefield challenges with ultra-efficient electronics and RF technology, and equivalently may advance related civilian technology. Recent theoretical predictions for the device concepts based on topological insulator/magnetic materials heterostructures far exceed today's state of the art for things such as sensing, sub-threshold switching with markedly reduced energy consumption, energy harvesting and radio frequency or even THz electronics. This fellowship is a unique opportunity to take full advantage of ARL's strategic intra-extramural reach with a seamless collaboration among ARL laboratories, extended campuses and leading academic scientists.
Who Can Apply
- Region
- United States
- Citizenship
- United States
- Project in
- United States
- Applicants
- individual
- Age
- 18 - 151 years old
Application Details
Stages
- 1 two_stage
Required documents
Review process
Applicants must first be selected by an advisor, then submit a research proposal to the ARL-RAP review panel for evaluation.
Additional benefits
- mentorship
External Application
This opportunity requires you to apply directly on the funder's website.
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- Award Amount
- Not specified
- Application Deadline
- No deadline
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