Scholarship
CPL Engineering and Architecture Scholarship and Internship
University at Buffalo
Award
Not specified
Closing date
Closed
Location
Global
For
Individuals
About this opportunity
The CPL Engineering and Architecture Scholarship and Internship was established by Richard B. Henry, III BS '90 and Deidre M. Henry, BA '90 as a non-tuition scholarship for students in the School of Architecture and Planning at the University at Buffalo. This scholarship is specifically designed for junior students who have completed ARC 302 and demonstrate financial need as determined by FAFSA. Preference is given to students from underrepresented communities. In addition to the scholarship award, recipients will be offered a paid internship opportunity at CPL Architecture Engineering Planning, which can be completed either during the academic year or during winter/summer breaks. This combined scholarship and internship program provides both financial support and valuable professional experience in the architecture, engineering, and planning fields.
Who can apply
Applicant Types
individual
Organization Types
academic
Region
United States
Priority Groups
racial_minorities
How to apply
Stages
- 1 single_stage
Additional benefits
- career_services
Restrictions
- geographic_restrictions