CPL Engineering and Architecture Scholarship and Internship
Not specified
Jun 14, 2024
United States
individual
About This Opportunity
The CPL Engineering and Architecture Scholarship and Internship was established by Richard B. Henry, III BS '90 and Deidre M. Henry, BA '90 as a non-tuition scholarship for students in the School of Architecture and Planning at the University at Buffalo. This scholarship is specifically designed for junior students who have completed ARC 302 and demonstrate financial need as determined by FAFSA. Preference is given to students from underrepresented communities. In addition to the scholarship award, recipients will be offered a paid internship opportunity at CPL Architecture Engineering Planning, which can be completed either during the academic year or during winter/summer breaks. This combined scholarship and internship program provides both financial support and valuable professional experience in the architecture, engineering, and planning fields.
Who Can Apply
- Region
- United States
- Applicants
- individual
- Organizations
- academic
- Priority for
- racial_minorities
Application Details
Stages
- 1 single_stage
Additional benefits
- career_services
Restrictions
- geographic_restrictions
External Application
This opportunity requires you to apply directly on the funder's website.
Apply on External SiteAI-Extracted Data
This opportunity was automatically extracted from an external source using AI. Details such as amounts, deadlines, and eligibility may be incomplete or inaccurate.
Always verify on the official sourceKey Information
- Award Amount
- Not specified
- Application Deadline
-
June 14, 2024 at 23:59 UTCDeadline passed
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