Scholarship

CPL Engineering and Architecture Scholarship and Internship

University at Buffalo Original Source
Award

Not specified

Deadline

Jun 14, 2024

Deadline passed
Location

United States

Applicants

individual

About This Opportunity

The CPL Engineering and Architecture Scholarship and Internship was established by Richard B. Henry, III BS '90 and Deidre M. Henry, BA '90 as a non-tuition scholarship for students in the School of Architecture and Planning at the University at Buffalo. This scholarship is specifically designed for junior students who have completed ARC 302 and demonstrate financial need as determined by FAFSA. Preference is given to students from underrepresented communities. In addition to the scholarship award, recipients will be offered a paid internship opportunity at CPL Architecture Engineering Planning, which can be completed either during the academic year or during winter/summer breaks. This combined scholarship and internship program provides both financial support and valuable professional experience in the architecture, engineering, and planning fields.

Who Can Apply

Region
United States
Applicants
individual
Organizations
academic
Priority for
racial_minorities

Application Details

Stages

  1. 1 single_stage

Additional benefits

  • career_services

Restrictions

  • geographic_restrictions