ECS IA Resilience 2026 – Market-Oriented Call on Power Electronics

The objective of this call is to strengthen Europe's resilience and global competitiveness in power electronics by accelerating the development and industrialisation of next-generation power semiconductor technologies, including Wide Band Gap (WBG) devices and advanced integration and packaging solutions. Projects should deliver market-near innovations that improve energy efficiency, power density, thermal performance and cost competitiveness, while enabling secure and sovereign European value chains from materials to system level. The call promotes fast, iterative development cycles and the use of advanced methods and tools, including AI, to support rapid market entry and large-scale industrial deployment. Innovation Fund Denmark offers co-funding to Danish participants in projects successful in this international call through the Chips Joint Undertaking program. The call targets Danish universities, companies, industry organisations, RTOs and research organisations, with all Danish organisations directly involved in project activities eligible as applicants.