Scholarship in Novel High-Performance Copper-Based Materials

This Scholarship has been established to provide financial assistance to a research student who is undertaking research in Novel High-Performance Copper-Based Materials via Additive Manufacturing. The project aims to develop novel high-performance copper-based materials produced by additive manufacturing for the electrification revolution, which will provide significantly higher mechanical performance, superior electrical and thermal properties and enable flexible complex shape options. The Scholarship provides a stipend allowance equivalent to the University of Sydney's Research Training Program (RTP) stipend rate, indexed annually on 1 January each year. For international students, academic course fees and the Student Services and Amenities Fee (SSAF) are also covered. The scholarship supports full-time Master's by Research students for up to 1.75 years or PhD students for up to three years with a possible six-month extension, subject to satisfactory academic performance.