Scholarship

The US Industry Placement Program Scholarship

University of Sydney
Award AUD 5.3K–8K
Closing date No closing date
Location Global
For Individuals

About this opportunity

The US Industry Placement Program Scholarship supports domestic and international students enrolled in the US Industry Placement Program at the University of Sydney Business School. This scholarship has been established to enrich the student experience and promote the international profile of this program. The scholarship provides financial support to students undertaking industry placement in the United States through specific coursework units (BUSS2501 or BUSS6503). Recipients are selected based on academic merit combined with either demonstrated leadership capabilities or demonstrated financial need. The scholarship is designed to help students participate in valuable work-integrated learning experiences in the United States while pursuing their coursework degrees at the University of Sydney Business School.

Who can apply

Applicant Types

individual

Project Locations

πŸ‡ΊπŸ‡Έ United States

Region

Australia

How to apply

Interview required Institutional approval

Stages

  1. 1 single_stage

Review process

Selection by committee consisting of at least two Sydney Business School staff, based on academic merit, approval to undertake the US Industry Placement Program, online application and interview, and demonstrated leadership capabilities or financial hardship.

Restrictions

  • no_concurrent_funding
  • reporting_requirements