Scholarship
The US Industry Placement Program Scholarship
University of Sydney
Award
AUD 5.3Kβ8K
Closing date
No closing date
Location
Global
For
Individuals
About this opportunity
The US Industry Placement Program Scholarship supports domestic and international students enrolled in the US Industry Placement Program at the University of Sydney Business School. This scholarship has been established to enrich the student experience and promote the international profile of this program. The scholarship provides financial support to students undertaking industry placement in the United States through specific coursework units (BUSS2501 or BUSS6503). Recipients are selected based on academic merit combined with either demonstrated leadership capabilities or demonstrated financial need. The scholarship is designed to help students participate in valuable work-integrated learning experiences in the United States while pursuing their coursework degrees at the University of Sydney Business School.
Who can apply
Applicant Types
individual
Project Locations
πΊπΈ United States
Region
Australia
How to apply
Interview required
Institutional approval
Stages
- 1 single_stage
Review process
Selection by committee consisting of at least two Sydney Business School staff, based on academic merit, approval to undertake the US Industry Placement Program, online application and interview, and demonstrated leadership capabilities or financial hardship.
Restrictions
- no_concurrent_funding
- reporting_requirements