USA Industry Placement Program Scholarship

The USA Industry Placement Program Scholarship has been established to enrich the student experience and promote the international profile of the University of Sydney Business School's industry placement program. This coursework scholarship supports students enrolled in BWIL2215 or BWIL6215 unit of study who undertake an approved unpaid placement during the semester in the USA. The scholarship provides financial support to offset costs associated with international placement experiences. The scholarship is awarded on the basis of academic merit combined with either demonstrated leadership capabilities or demonstrated financial hardship. Recipients must have completed at least 24 credit points in their coursework degree at the Business School and maintain a minimum Weighted Average Mark (WAM) of 70, or a WAM of 60 if demonstrating financial hardship. The scholarship is designed to make international industry placement opportunities more accessible to deserving students. This is a one-off payment made during the first month of the placement, with different funding levels depending on whether the award is based on leadership capabilities or financial need. Recipients are expected to complete all program requirements and may be asked to participate in marketing and promotion of the Placement Program.